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Analysis of steady state micro-droplet evaporation to enhance heat dissipation from tiny surfaces.
| Title: | Analysis of steady state micro-droplet evaporation to enhance heat dissipation from tiny surfaces. |
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| Name(s): |
Voota, Harish, Author Putnam, Shawn, Committee Chair Kauffman, Jeffrey, Committee CoChair Vasu Sumathi, Subith, Committee Member University of Central Florida, Degree Grantor |
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| Type of Resource: | text | |
| Date Issued: | 2015 | |
| Publisher: | University of Central Florida | |
| Language(s): | English | |
| Abstract/Description: | Steady state droplet evaporation experiments are conducted to understand (1) Droplet contact line influence on evaporation rate and (2) Droplet contact angle correlation to evaporation rate. Experiments are performed on a polymer substrate with a moat like trench (laser patterned) to control droplet contact line dynamics. A bottom-up methodology is implemented for droplet formation on the patterned substrate. Droplet evaporation rates on substrate temperatures 22???T_Substrate?70? and contact angles 80(&)deg;???110(&)deg; are measured. For a pinned microdroplet (CCR), volumetric infuse rate influences droplet contact angle. Results illustrate droplet contact line impact on evaporation rate . Moreover, these results coincide with previously published results and affirm that evaporation rate efficiency reduces with contact line depinning. Additionally, from all the analyzed experimental cases, evaporation rate scales proportional to the microdroplet contact angle (i.e. ?_(LG )??). In conclusion, these experiments shed new light on steady state evaporation of a microdroplet and its corresponding observations. Vital research findings can be used to enhance heat dissipation from tiny surfaces. | |
| Identifier: | CFE0006235 (IID), ucf:51067 (fedora) | |
| Note(s): |
2015-08-01 M.S.M.E. Engineering and Computer Science, Mechanical and Aerospace Engineering Masters This record was generated from author submitted information. |
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| Subject(s): | Evaporation rate to contact line correlation -- Heat flux -- Droplet evaporation -- Diffusion models -- Steady state droplet evaporation -- Droplet constant contact radius -- Droplet constant contact angle -- heat dissipation -- evaporation rate -- evaporative cooling | |
| Persistent Link to This Record: | http://purl.flvc.org/ucf/fd/CFE0006235 | |
| Restrictions on Access: | public 2016-02-15 | |
| Host Institution: | UCF |
