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(1 - 8 of 8)
- Title
- Three-Dimensional Simulation Study of Low Voltage ((<)100V) Superjunction Lateral DMOS power transistors.
- Creator
-
Garcia, Jhonatan, Yuan, Jiann-Shiun, Sundaram, Kalpathy, Fan, Deliang, University of Central Florida
- Abstract / Description
-
A new revolutionary concept was presented two decades ago, known as (")semiconductor Superjunction (SJ) theory(") to enhance the trade-off relationship between speci?c on resistance, Rsp, and off-state breakdown voltage, BV, in medium to high voltages (more than 100 V) power MOSFETs. The SJ concept was ?rst applied and commercialized to vertical structures, but it hasn't been used yet in low voltage MOSFETs with lateral structures. This thesis provides a review of the most common structures,...
Show moreA new revolutionary concept was presented two decades ago, known as (")semiconductor Superjunction (SJ) theory(") to enhance the trade-off relationship between speci?c on resistance, Rsp, and off-state breakdown voltage, BV, in medium to high voltages (more than 100 V) power MOSFETs. The SJ concept was ?rst applied and commercialized to vertical structures, but it hasn't been used yet in low voltage MOSFETs with lateral structures. This thesis provides a review of the most common structures, principles and design techniques for discrete power MOSFETs. It also presents a simulation study of the application of these SJ concepts in the design of a Low Voltage SJ LDMOS transistor, using TCAD software. To make the device commercially feasible, this device design targets aggressive goals such as an off-state Breakdown Voltage of 60V with Rspof 20 miliohms per milimiter square. This study includes the analysis of the ?ow process for the fabrication of this transistor, using semiconductor technologies, and the simulation results, including Breakdown Voltage, on-state resistance, electric ?eld distribution among others simulation analysis.
Show less - Date Issued
- 2016
- Identifier
- CFE0006306, ucf:51600
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0006306
- Title
- MODELING AND ANALYSIS OF POWER MOSFETS FOR HIGH FREQUENCY DC-DC CONVERTERS.
- Creator
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Xiong, Yali, Shen, John, University of Central Florida
- Abstract / Description
-
Evolutions in integrated circuit technology require the use of a high-frequency synchronous buck converter in order to achieve low cost, low profile, fast transient response and high power density. However, high frequency operation leads to increased power MOSFET switching losses. Optimization of the MOSFETs plays an important role in improving converter performance. This dissertation focuses on revealing the power loss mechanism of power MOSFETs and the relationship between power MOSFET...
Show moreEvolutions in integrated circuit technology require the use of a high-frequency synchronous buck converter in order to achieve low cost, low profile, fast transient response and high power density. However, high frequency operation leads to increased power MOSFET switching losses. Optimization of the MOSFETs plays an important role in improving converter performance. This dissertation focuses on revealing the power loss mechanism of power MOSFETs and the relationship between power MOSFET structure and its power loss. The analytical device model, combined with circuit modeling, cannot reveal the relationship between device structure and its power loss due to the highly non-linear characteristics of power MOSFETs. A physically-based mixed device/circuit modeling approach is used to investigate the power losses of the MOSFETs under different operating conditions. The physically based device model, combined with SPICE-like circuit simulation, provides an expeditious and inexpensive way of evaluating and optimizing circuit and device concepts. Unlike analytical or other SPICE models of power MOSFETs, the numerical device model, relying little on approximations or simplifications, faithfully represents the behavior of realistic power MOSFETs. The impact of power MOSFET parameters on efficiency of synchronous buck converters, such as gate charge, on resistance, reverse recovery, is studied in detail in this thesis. The results provide a good indication on how to optimize power MOSFETs used in VRMs. The synchronous rectifier plays an important role in determining the performance of the synchronous buck converter. The reverse recovery of its body diode and the Cdv/dt induced false trigger-on are two major mechanisms that impact SyncFET's performance. This thesis gives a detailed analysis of the SyncFET operation mechanism and provides several techniques to reduce its body-diode influence and suppress its false Cdv/dt trigger-n. This thesis also investigates the influence of several circuit level parameters on the efficiency of the synchronous buck converter, such as input voltage, circuit parasitic inductance, and gate resistance to provide further optimization of synchronous buck converter design.
Show less - Date Issued
- 2008
- Identifier
- CFE0002278, ucf:47858
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0002278
- Title
- High Performance Low Voltage Power MOSFET for High-Frequency Synchronous Buck Converters.
- Creator
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Yang, Boyi, Shen, Zheng, Yuan, Jiann-Shiun, Sundaram, Kalpathy, Wu, Xinzhang, Xu, Shuming, University of Central Florida
- Abstract / Description
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Power management solutions such as voltage regulator (VR) mandate DC-DC converters with high power density, high switching frequency and high efficiency to meet the needs of future computers and telecom equipment. The trend towards DC-DC converters with higher switching frequency presents significant challenges to power MOSFET technology. Optimization of the MOSFETs plays an important role in improving low-voltage DC-DC converter performance. This dissertation focuses on developing and...
Show morePower management solutions such as voltage regulator (VR) mandate DC-DC converters with high power density, high switching frequency and high efficiency to meet the needs of future computers and telecom equipment. The trend towards DC-DC converters with higher switching frequency presents significant challenges to power MOSFET technology. Optimization of the MOSFETs plays an important role in improving low-voltage DC-DC converter performance. This dissertation focuses on developing and optimizing high performance low voltage power MOSFETs for high frequency applications.With an inherently large gate charge, the trench MOSFET suffers significant switching power losses and cannot continue to provide sufficient performance in high frequency applications. Moreover, the influence of parasitic impedance introduced by device packaging and PCB assembly in board level power supply designs becomes more pronounced as the output voltage continues to decrease and the nominal current continues to increase. This eventually raises the need for highly integrated solutions such as power supply in package (PSiP) or on chip (PSoC). However, it is often more desirable in some PSiP architectures to reverse the source/drain electrodes from electrical and/or thermal point of view. In this dissertation, a stacked-die Power Block PSiP architecture is first introduced to enable DC-DC buck converters with a current rating up to 40 A and a switching frequency in the MHz range. New high- and low-side NexFETs are specially designed and optimized for the new PSiP architecture to maximize its efficiency and power density. In particular, a new NexFET structure with its source electrode on the bottom side of the die (source-down) is designed to enable the innovative stacked-die PSiP technology with significantly reduced parasitic inductance and package footprint.It is also observed that in synchronous buck converter very fast switching of power MOSFETs sometimes leads to high voltage oscillations at the phase node of the buck converter, which may introduce additional power loss and cause EMI related problems and undesirable electrical stress to the power MOSFET. At the same time, the synchronous MOSFET plays an important role in determining the performance of the synchronous buck converter. The reverse recovery of its body diode and the Cdv/dt induced false trigger-on are two major mechanisms that impact the performance of the SyncFET. This dissertation introduces a new approach to effectively overcome the aforementioned challenges associated with the state-of-art technology. The threshold voltage of the low-side NexFET is intentionally reduced to minimize the conduction and body diode related power losses. Meanwhile, a monolithically integrated gate voltage pull-down circuitry is proposed to overcome the possible Cdv/dt induced turn-on issue inadvertently induced by the low VTH SynFET.Through extensive modeling and simulation, all these innovative concepts are integrated together in a power module and fabricated with a 0.35(&)#181;m process. With all these novel device technology improvements, the new power module delivers a significant improvement in efficiency and offers an excellent solution for future high frequency, high current density DC-DC converters. Megahertz operation of a Power Block incorporating these new device techniques is demonstrated with an excellent efficiency observed.
Show less - Date Issued
- 2012
- Identifier
- CFE0004642, ucf:49885
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0004642
- Title
- HIGHLY INTEGRATED DC-DC CONVERTERS.
- Creator
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Jia, Hongwei, Shen, Zhen, University of Central Florida
- Abstract / Description
-
A monolithically integrated smart rectifier has been presented first in this work. The smart rectifier, which integrates a power MOSFET, gate driver and control circuitry, operates in a self-synchronized fashion based on its drain-source voltage, and does not need external control input. The analysis, simulation, and design considerations are described in detail. A 5V, 5-μm CMOS process was used to fabricate the prototype. Experimental results show that the proposed rectifier functions...
Show moreA monolithically integrated smart rectifier has been presented first in this work. The smart rectifier, which integrates a power MOSFET, gate driver and control circuitry, operates in a self-synchronized fashion based on its drain-source voltage, and does not need external control input. The analysis, simulation, and design considerations are described in detail. A 5V, 5-μm CMOS process was used to fabricate the prototype. Experimental results show that the proposed rectifier functions as expected in the design. Since no dead-time control needs to be used to switch the sync-FET and ctrl-FET, it is expected that the body diode losses can be reduced substantially, compared to the conventional synchronous rectifier. The proposed self-synchronized rectifier (SSR) can be operated at high frequencies and maintains high efficiency over a wide load range. As an example of the smart rectifierÂÂÂÂ's application in isolated DC-DC converter, a synchronous flyback converter with SSR is analyzed, designed and tested. Experimental results show that the operating frequency could be as high as 4MHz and the efficiency could be improved by more than 10% compared to that when a hyper fast diode rectifier is used. Based on a new current-source gate driver scheme, an integrated gate driver for buck converter is also developed in this work by using a 0.35μm CMOS process with optional high voltage (50V) power MOSFET. The integrated gate driver consists both the current-source driver for high-side power MOSFET and low-power driver for low-side power iv MOSFET. Compared with the conventional gate driver circuit, the current-source gate driver can recovery some gate charging energy and reduce switching loss. So the current-source driver (CSD) can be used to improve the efficiency performance in high frequency power converters. This work also presents a new implementation of a power supply in package (PSiP) 5MHz buck converter, which is different from all the prior-of-art PSiP solutions by using a high-Q bondwire inductor. The high-Q bondwire inductor can be manufactured by applying ferrite epoxy to the common bondwire during standard IC packaging process, so the new implementation of PSiP is expected to be a cost-effective way of power supply integration.
Show less - Date Issued
- 2010
- Identifier
- CFE0003040, ucf:48354
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0003040
- Title
- Lateral Power MOSFETs Hardened Against Single Event Radiation Effects.
- Creator
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Shea, Patrick, Shen, Zheng, Yuan, Jiann-Shiun, Malocha, Donald, University of Central Florida
- Abstract / Description
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The underlying physical mechanisms of destructive single event effects (SEE) from heavy ion radiation have been widely studied in traditional vertical double-diffused power MOSFETs (VDMOS). Recently lateral double-diffused power MOSFETs (LDMOS), which inherently provide lower gate charge than VDMOS, have become an attractive option for MHz-frequency DC-DC converters in terrestrial power electronics applications. There are growing interests in extending the LDMOS concept into radiation-hard...
Show moreThe underlying physical mechanisms of destructive single event effects (SEE) from heavy ion radiation have been widely studied in traditional vertical double-diffused power MOSFETs (VDMOS). Recently lateral double-diffused power MOSFETs (LDMOS), which inherently provide lower gate charge than VDMOS, have become an attractive option for MHz-frequency DC-DC converters in terrestrial power electronics applications. There are growing interests in extending the LDMOS concept into radiation-hard space applications. Since the LDMOS has a device structure considerably different from VDMOS, the well studied single event burn-out (SEB) or single event gate rapture (SEGR) response of VDMOS cannot be simply assumed for LDMOS devices without further investigation. A few recent studies have begun to investigate ionizing radiation effects in LDMOS devices, however, these studies were mainly focused on displacement damage and total ionizing dose (TID) effects, with very limited data reported on the heavy ion SEE response of these devices. Furthermore, the breakdown voltage of the LDMOS devices in these studies was limited to less than 80 volts (mostly in the range of 20-30 volts), considerably below the voltage requirement for some space power applications. In this work, we numerically and experimentally investigate the physical insights of SEE in two different fabricated LDMOS devices designed by the author and intended for use in radiation hard applications. The first device is a 24 V Resurf LDMOS fabricated on P-type epitaxial silicon on a P+ silicon substrate. The second device is a much different 150 V SOI Resurf LDMOS fabricated on a 1.0 micron thick N-type silicon-on-insulator substrate with a 1.0 micron thick buried silicon dioxide layer on an N-type silicon handle wafer. Each device contains internal features, layout techniques, and process methods designed to improve single event and total ionizing dose radiation hardness. Technology computer aided design (TCAD) software was used to develop the transistor design and fabrication process of each device and also to simulate the device response to heavy ion radiation. Using these simulations in conjunction with experimentally gathered heavy ion radiation test data, we explain and illustrate the fundamental physical mechanisms by which destructive single event effects occur in these LDMOS devices. We also explore the design tradeoffs for making an LDMOS device resistant to destructive single event effects, both in terms of electrical performance and impact on other radiation hardness metrics.
Show less - Date Issued
- 2011
- Identifier
- CFE0004165, ucf:49044
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0004165
- Title
- DESIGN AND MODELING OF RADIATION HARDENED LATERAL POWER MOSFETS.
- Creator
-
Landowski, Matthew, Shen, Zheng, University of Central Florida
- Abstract / Description
-
Galactic-cosmic-rays (GCR) exist in space from unknown origins. A cosmic ray is a very high energy electron, proton, or heavy ion. As a GCR transverses a power semiconductor device, electron-hole-pairs (ehps) are generated along the ion track. Effects from this are referred to as single-event-effects (SEEs). A subset of a SEE is single-event burnout (SEB) which occurs when the parasitic bipolar junction transistor is triggered leading to thermal runaway. The failure mechanism is a complicated...
Show moreGalactic-cosmic-rays (GCR) exist in space from unknown origins. A cosmic ray is a very high energy electron, proton, or heavy ion. As a GCR transverses a power semiconductor device, electron-hole-pairs (ehps) are generated along the ion track. Effects from this are referred to as single-event-effects (SEEs). A subset of a SEE is single-event burnout (SEB) which occurs when the parasitic bipolar junction transistor is triggered leading to thermal runaway. The failure mechanism is a complicated mix of photo-generated current, avalanche generated current, and activation of the inherent parasitic bipolar transistor. Current space-borne power systems lack the utility and advantages of terrestrial power systems. Vertical-double-diffused MOSFETs (VDMOS) is by far the most common power semiconductor device and are very susceptible to SEEs by their vertical structure. Modern space power switches typically require system designers to de-rate the power semiconductor switching device to account for this. Consequently, the power system suffers from increased size, cost, and decreased performance. Their switching speed is limited due to their vertical structure and cannot be used for MHz frequency applications limiting the use of modern digital electronics for space missions. Thus, the Power Semiconductor Research Laboratory at the University of Central Florida in conjunction with Sandia National Laboratories is developing a rad-hard by design lateral-double-diffused MOSFET (LDMOS). The study provides a novel in-depth physical analysis of the mechanisms that cause the LDMOS to burnout during an SEE and provides guidelines for making the LDMOS rad-hard to SEB. Total dose radiation, another important radiation effect, can cause threshold voltage shifts but is beyond the scope of this study. The devices presented have been fabricated with a known total dose radiation hard CMOS process. Single-event burnout data from simulations and experiments are presented in the study to prove the viability of using the LDMOS to replace the VDMOS for space power systems. The LDMOS is capable of higher switching speeds due to a reduced drain-gate feedback capacitance (Miller Capacitor). Since the device is lateral it is compatible with complimentary-metal-oxide-semiconductor (CMOS) processes, lowering developing time and fabrication costs. High switching frequencies permit the use of high density point-of-load conversion and provide a fast dynamic response.
Show less - Date Issued
- 2009
- Identifier
- CFE0002795, ucf:48113
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0002795
- Title
- DESIGN AND MODELING OF RADIATION HARDENED LDMOSFET FOR SPACE CRAFT POWER SYSTEMS.
- Creator
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Shea, Patrick, Shen, John, University of Central Florida
- Abstract / Description
-
NASA missions require innovative power electronics system and component solutions with long life capability, high radiation tolerance, low mass and volume, and high reliability in space environments. Presently vertical double-diffused MOSFETs (VDMOS) are the most widely used power switching device for space power systems. It is proposed that a new lateral double-diffused MOSFET (LDMOS) designed at UCF can offer improvements in total dose and single event radiation hardness, switching...
Show moreNASA missions require innovative power electronics system and component solutions with long life capability, high radiation tolerance, low mass and volume, and high reliability in space environments. Presently vertical double-diffused MOSFETs (VDMOS) are the most widely used power switching device for space power systems. It is proposed that a new lateral double-diffused MOSFET (LDMOS) designed at UCF can offer improvements in total dose and single event radiation hardness, switching performance, development and manufacturing costs, and total mass of power electronics systems. Availability of a hardened fast-switching power MOSFET will allow space-borne power electronics to approach the current level of terrestrial technology, thereby facilitating the use of more modern digital electronic systems in space. It is believed that the use of a p+/p-epi starting material for the LDMOS will offer better hardness against single-event burnout (SEB) and single-event gate rupture (SEGR) when compared to vertical devices fabricated on an n+/n-epi material. By placing a source contact on the bottom-side of the p+ substrate, much of the hole current generated by a heavy ion strike will flow away from the dielectric gate, thereby reducing electrical stress on the gate and decreasing the likelihood of SEGR. Similarly, the device is hardened against SEB by the redirection of hole current away from the base of the device's parasitic bipolar transistor. Total dose hardness is achieved by the use of a standard complementary metal-oxide semiconductor (CMOS) process that has shown proven hardness against total dose radiation effects.
Show less - Date Issued
- 2007
- Identifier
- CFE0001966, ucf:47468
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0001966
- Title
- FINITE ELEMENT METHOD MODELING OF ADVANCED ELECTRONIC DEVICES.
- Creator
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Chen, Yupeng, Wu, Thomas, University of Central Florida
- Abstract / Description
-
In this dissertation, we use finite element method together with other numerical techniques to study advanced electron devices. We study the radiation properties in electron waveguide structure with multi-step discontinuities and soft wall lateral confinement. Radiation mechanism and conditions are examined by numerical simulation of dispersion relations and transport properties. The study of geometry variations shows its significant impact on the radiation intensity and direction. In...
Show moreIn this dissertation, we use finite element method together with other numerical techniques to study advanced electron devices. We study the radiation properties in electron waveguide structure with multi-step discontinuities and soft wall lateral confinement. Radiation mechanism and conditions are examined by numerical simulation of dispersion relations and transport properties. The study of geometry variations shows its significant impact on the radiation intensity and direction. In particular, the periodic corrugation structure exhibits strong directional radiation. This interesting feature may be useful to design a nano-scale transmitter, a communication device for future nano-scale system. Non-quasi-static effects in AC characteristics of carbon nanotube field-effect transistors are examined by solving a full time-dependent, open-boundary Schrödinger equation. The non-quasi-static characteristics, such as the finite channel charging time, and the dependence of small signal transconductance and gate capacitance on the frequency, are explored. The validity of the widely used quasi-static approximation is examined. The results show that the quasi-static approximation overestimates the transconductance and gate capacitance at high frequencies, but gives a more accurate value for the intrinsic cut-off frequency over a wide range of bias conditions. The influence of metal interconnect resistance on the performance of vertical and lateral power MOSFETs is studied. Vertical MOSFETs in a D2PAK and DirectFET package, and lateral MOSFETs in power IC and flip chip are investigated as the case studies. The impact of various layout patterns and material properties on RDS(on) will provide useful guidelines for practical vertical and lateral power MOSFETs design.
Show less - Date Issued
- 2006
- Identifier
- CFE0001389, ucf:46987
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0001389
