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- Title
- EFFECT OF GERMANIUM DOPING ON ERBIUM SENSITIZATION IN THE ERBIUM DOPED SILICON RICH SILICA MATERIAL SYSTEM.
- Creator
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Ruhge, Forrest, Kik, Pieter, University of Central Florida
- Abstract / Description
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The continued size reduction in electronic integrated circuits has lead to a demand for on-chip high-bandwidth and low loss communication channels. Optical interconnects are considered an essential addition to the silicon electronics platform. A major challenge in the field of integrated Si photonics is the development of cost effective silicon compatible light sources. This thesis investigates the sensitization of group IV doped silica films emitting at 1.535μm for applications as...
Show moreThe continued size reduction in electronic integrated circuits has lead to a demand for on-chip high-bandwidth and low loss communication channels. Optical interconnects are considered an essential addition to the silicon electronics platform. A major challenge in the field of integrated Si photonics is the development of cost effective silicon compatible light sources. This thesis investigates the sensitization of group IV doped silica films emitting at 1.535μm for applications as silicon compatible light sources. Thin erbium-doped silica films containing excess silicon and germanium were deposited using a multi-gun sputter system. The composition of the deposited materials was verified by Rutherford Backscattering Spectrometry. Samples from each deposition were annealed in a controlled atmosphere tube furnace at temperatures between 500ºC and 1100ºC for 30 minutes. The photoluminescence spectra from the visible to the near-infrared region were acquired while pumping either near or far from the Er3+ absorption lines. Under both excitation conditions all samples annealed at temperatures below 1000ºC show clear emission at 1.535μm from Er3+ ions in the host material. In the current literature this is attributed to exciton mediated excitation of the Er3+. By contrast, in these studies indirect excitation was observed for samples annealed at temperatures well below the onset of nanocrystal nucleation and growth (between 500ºC and 1000ºC), suggesting excitation via small clusters or lattice defects. These findings could have significant implications in the further development of group IV sensitized silicon compatible gain media.
Show less - Date Issued
- 2006
- Identifier
- CFE0001439, ucf:47066
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0001439
- Title
- GATE STACK AND CHANNEL ENGINEERING:STUDY OF METAL GATES AND GERMANIUM CHANNEL DEVICES.
- Creator
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Todi, Ravi, Sundaram, Kalpathy, University of Central Florida
- Abstract / Description
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The continued scaling of device dimensions in complementary metal oxide semiconductor (CMOS) technology within the sub-100 nm region requires an alternative high dielectric constant (high-κ) oxide layer to counter high tunneling leakage currents, a metallic gate electrode to address polysilicon depletion, boron penetration and high polysilicon sheet resistance, and high mobility channel materials to boost the CMOS performance. Metal gates can also offer improved thermal and chemical...
Show moreThe continued scaling of device dimensions in complementary metal oxide semiconductor (CMOS) technology within the sub-100 nm region requires an alternative high dielectric constant (high-κ) oxide layer to counter high tunneling leakage currents, a metallic gate electrode to address polysilicon depletion, boron penetration and high polysilicon sheet resistance, and high mobility channel materials to boost the CMOS performance. Metal gates can also offer improved thermal and chemical stability, but their use requires that we improve our understanding of how the metal alloy phase, crystallographic orientation, and composition affect the electronic properties of the metal alloy-oxide interface. To replace n++ and p++ polysilicon gate electrodes and maintain scaled device performance requires metal gate electrodes with work functions within 0.2 eV of the silicon conduction and valence band edges, i.e., 5.0-5.2 and 4.1-4.3 eV, for PMOS and NMOS devices, respectively. In addition to work function and thermal/chemical stability, metal gates must be integrated into the CMOS process flow. It is the aim of this work to significantly expand our knowledge base in alloys for dual metal gates by carrying out detailed electrical and materials studies of the binary alloy systems of Ru with p-type metal Pt. Three n-type metals systems, Ru-Ta, Ru-Hf and Ru-Nb have also been partially investigated. This work also focuses on high mobility Ge p-MOSFETs for improved CMOS performance. DC magnetron sputtering has been used to deposit binary alloy films on thermally grown SiO2. The composition of the alloy films have been determined by Rutherford backscattering spectrometry and the identification of phases present have been made using x-ray and electron diffraction of samples. The microstructure of the phases of interest has been examined in the transmission electron microscope and film texture was characterized via x-ray diffraction. The electrical characterization includes basic resistivity measurements, and work function extraction. The work function has been determined from MOS capacitor and Schottky diodes. The need for electron and hole mobility enhancement and the progress in the development of high-κ gate stacks, has lead to renewed interest in Ge MOSFETs. The p-MOS mobility data for Ge channel devices have been reported. The results indicate greater than 2 x improvements in device mobility as compared to standard Si device. A low frequency noise assessment of silicon passivated Ge p-MOSFETs with a TiN/TaN/HfO2 gate stack has been made. For the first time we also report results on low frequency noise characterisation for a Ge P+- n junctions with and without Ni germanidation.
Show less - Date Issued
- 2007
- Identifier
- CFE0001554, ucf:47122
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0001554
- Title
- MONTE CARLO SIMULATION OF HOLE TRANSPORT AND TERAHERTZ AMPLIFICATION IN MULTILAYER DELTA DOPED SEMICONDUCTOR STRUCTURES.
- Creator
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Dolguikh, Maxim, Peale, Robert, University of Central Florida
- Abstract / Description
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Monte Carlo method for the simulation of hole dynamics in degenerate valence subbands of cubic semiconductors is developed. All possible intra- and inter-subband scattering rates are theoretically calculated for Ge, Si, and GaAs. A far-infrared laser concept based on intersubband transitions of holes in p-type periodically delta-doped semiconductor films is studied using numerical Monte-Carlo simulation of hot hole dynamics. The considered device consists of monocrystalline pure Ge layers...
Show moreMonte Carlo method for the simulation of hole dynamics in degenerate valence subbands of cubic semiconductors is developed. All possible intra- and inter-subband scattering rates are theoretically calculated for Ge, Si, and GaAs. A far-infrared laser concept based on intersubband transitions of holes in p-type periodically delta-doped semiconductor films is studied using numerical Monte-Carlo simulation of hot hole dynamics. The considered device consists of monocrystalline pure Ge layers periodically interleaved with delta-doped layers and operates with vertical or in-plane hole transport in the presence of a perpendicular in-plane magnetic field. Inversion population on intersubband transitions arises due to light hole accumulation in E B fields, as in the bulk p-Ge laser. However, the considered structure achieves spatial separation of hole accumulation regions from the doped layers, which reduces ionized-impurity and carrier-carrier scattering for the majority of light holes. This allows remarkable increase of the gain in comparison with bulk p-Ge lasers. Population inversion and gain sufficient for laser operation are expected up to 77 K. Test structures grown by chemical vapor deposition demonstrate feasibility of producing the device with sufficient active thickness to allow quasioptical electrodynamic cavity solutions. The same device structure is considered in GaAs. The case of Si is much more complicated due to strong anisotropy of the valence band. The primary new result for Si is the first consideration of the anisotropy of optical phonon scattering for hot holes.
Show less - Date Issued
- 2005
- Identifier
- CFE0000863, ucf:46672
- Format
- Document (PDF)
- PURL
- http://purl.flvc.org/ucf/fd/CFE0000863
