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TRANSMISSION LINES FOR IR SIGNAL ROUTING

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Date Issued:
2006
Abstract/Description:
In this dissertation, the design, fabrication, and characterization of coplanar striplines, vias, and microstrip lines is investigated, from the point of view of developing interconnections for antenna-coupled infrared detectors operating in the 8- to 12-micron wavelength range. To our knowledge, no previous efforts have been made to study the performance of metallic-wire transmission lines at infrared frequencies. Both the design and fabrication of these structures present unique challenges. Because of attenuation and dispersion issues, the analytical formulas for transmission-line parameters that are valid below a few hundred GHz are not applicable in the infrared. Therefore, numerical modeling was performed to characterize the coplanar striplines and microstrip structures in terms of transmission-line parameters: characteristic impedance, attenuation constant and effective index of refraction. These parameters were extracted by fitting the computed impedance as a function of transmission-line length to the usual impedance transformation equation. The material properties used in the model are realistic, having been measured at the frequencies of interest by infrared ellipsometric techniques. The transmission-line parameters cannot be measured directly in the infrared, so experimental validation was carried out by measuring the response of a bolometer, which was connected to a dipole antenna by different lengths of both the coplanar and microstrip transmission lines. The modeled and measured responses for both types of transmission lines was in good agreement. A third type of signal-routing structure was also investigated, that of the vertical via, essentially a low-frequency connection that facilitates location of the bondpads away from the plane of the antenna. In the configuration studied, the vias pass vertically down through the SiO2 isolation layer and a groundplane, which provides electromagnetic isolation between the antenna and the structures that allow for signal-extraction from the bolometer. This type of interconnection will be useful for future detailed studies relating the angular antenna pattern to the spatial response of the antenna-coupled sensor.
Title: TRANSMISSION LINES FOR IR SIGNAL ROUTING.
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Name(s): Mandviwala, Tasneem, Author
Boreman, Glenn, Committee Chair
University of Central Florida, Degree Grantor
Type of Resource: text
Date Issued: 2006
Publisher: University of Central Florida
Language(s): English
Abstract/Description: In this dissertation, the design, fabrication, and characterization of coplanar striplines, vias, and microstrip lines is investigated, from the point of view of developing interconnections for antenna-coupled infrared detectors operating in the 8- to 12-micron wavelength range. To our knowledge, no previous efforts have been made to study the performance of metallic-wire transmission lines at infrared frequencies. Both the design and fabrication of these structures present unique challenges. Because of attenuation and dispersion issues, the analytical formulas for transmission-line parameters that are valid below a few hundred GHz are not applicable in the infrared. Therefore, numerical modeling was performed to characterize the coplanar striplines and microstrip structures in terms of transmission-line parameters: characteristic impedance, attenuation constant and effective index of refraction. These parameters were extracted by fitting the computed impedance as a function of transmission-line length to the usual impedance transformation equation. The material properties used in the model are realistic, having been measured at the frequencies of interest by infrared ellipsometric techniques. The transmission-line parameters cannot be measured directly in the infrared, so experimental validation was carried out by measuring the response of a bolometer, which was connected to a dipole antenna by different lengths of both the coplanar and microstrip transmission lines. The modeled and measured responses for both types of transmission lines was in good agreement. A third type of signal-routing structure was also investigated, that of the vertical via, essentially a low-frequency connection that facilitates location of the bondpads away from the plane of the antenna. In the configuration studied, the vias pass vertically down through the SiO2 isolation layer and a groundplane, which provides electromagnetic isolation between the antenna and the structures that allow for signal-extraction from the bolometer. This type of interconnection will be useful for future detailed studies relating the angular antenna pattern to the spatial response of the antenna-coupled sensor.
Identifier: CFE0001304 (IID), ucf:47025 (fedora)
Note(s): 2006-08-01
Ph.D.
Engineering and Computer Science, School of Electrical Engineering and Computer Science
Doctorate
This record was generated from author submitted information.
Subject(s): infrared
antenna
transmission line
Persistent Link to This Record: http://purl.flvc.org/ucf/fd/CFE0001304
Restrictions on Access: public
Host Institution: UCF

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