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PROCESS DEVELOPMENT FOR THE FABRICATION OF MESOSCALE ELECTROSTATIC VALVE ASSEMBLY

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Date Issued:
2007
Abstract/Description:
This study concentrates on two of the main processes involved in the fabrication of electrostatic valve assembly, thick resist photolithography and wet chemical etching of a polyamide film. The electrostatic valve has different orifice diameters of 25, 50, 75 and 100 μm. These orifice holes are to be etched in the silicon wafer with deep reactive ion etching. The photolithography process is developed to build a mask of 15 μm thick resist pattern on silicon wafer. This photo layer acts as a mask for deep reactive ion etching. Wet chemical etching process is developed to etch kapton polyamide film. This etched film is used as a stand off, gap between two electrodes of the electrostatic valve assembly. The criterion is to develop the processed using standard industry tools. Pre post etch effects, such as, surface roughness, etching pattern, critical dimensions on the samples are measured with Veeco profilometer.
Title: PROCESS DEVELOPMENT FOR THE FABRICATION OF MESOSCALE ELECTROSTATIC VALVE ASSEMBLY.
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Name(s): Dhru, Shailini, Author
Sundaram, Kalpathy, Committee Chair
University of Central Florida, Degree Grantor
Type of Resource: text
Date Issued: 2007
Publisher: University of Central Florida
Language(s): English
Abstract/Description: This study concentrates on two of the main processes involved in the fabrication of electrostatic valve assembly, thick resist photolithography and wet chemical etching of a polyamide film. The electrostatic valve has different orifice diameters of 25, 50, 75 and 100 μm. These orifice holes are to be etched in the silicon wafer with deep reactive ion etching. The photolithography process is developed to build a mask of 15 μm thick resist pattern on silicon wafer. This photo layer acts as a mask for deep reactive ion etching. Wet chemical etching process is developed to etch kapton polyamide film. This etched film is used as a stand off, gap between two electrodes of the electrostatic valve assembly. The criterion is to develop the processed using standard industry tools. Pre post etch effects, such as, surface roughness, etching pattern, critical dimensions on the samples are measured with Veeco profilometer.
Identifier: CFE0001828 (IID), ucf:47347 (fedora)
Note(s): 2007-08-01
M.S.
Engineering and Computer Science, Other
Masters
This record was generated from author submitted information.
Subject(s): Fabrication
Cryogenic
Photolithography
Photoresist
Wet Etching
Deep Reactive Ion Etching
Kapton
Polyamide
Profilometer
Persistent Link to This Record: http://purl.flvc.org/ucf/fd/CFE0001828
Restrictions on Access: public
Host Institution: UCF

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