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REACTION VELOCITIES IN FREE STANDING ALUMINUM AND COPPER OXIDE THIN FILMS

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Date Issued:
2009
Abstract/Description:
In this work we investigate the reaction propagation velocity of aluminum and copper oxide Metastable Intermolecular Composites (MIC's). All samples were deposited in a magnetron sputtering system using 2 aluminum targets and 2 copper targets. The copper is sputtered in an oxygen rich environment in order to obtain copper oxide rich films. Three different layer structures are used for various measurements that are composed of alternating 20 layer pairs, 30 layer pairs, and 40 layer pairs. All layer pairs maintain a constant total thickness of 3.2 microns. Each layer structure can be prepared independent of a substrate and is measured with the use of photodiodes or with direct device contact. Aluminum and copper oxide structures have potential use as propellants and additives to explosives, thus, accurate propagation velocity or burn rate measurements are important. The developed measurement system for burn rate measurements of Al/CuO MIC's can achieve and accuracy of 0.1 m/s. In order to determine the velocity limiting characteristics, MIC's on glass and silicon substrates were measured as well as free standing Al/CuO MIC's. Separate burn rate measurement devices were created in order to handle the variety of substrates. In addition, the ignition energy of the Al/CuO MIC was studied to further characterize the samples. This was done using both voltage and current probes of a reacting sample. Rutherford backscattering spectroscopy (RBS) was used for sample composition calibration. The pre- and post-reaction Al/CuO MIC's were also characterized by transmission electron microscopy (TEM).
Title: REACTION VELOCITIES IN FREE STANDING ALUMINUM AND COPPER OXIDE THIN FILMS.
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Name(s): Erickson, Matthew, Author
Coffey, Kevin, Committee Chair
University of Central Florida, Degree Grantor
Type of Resource: text
Date Issued: 2009
Publisher: University of Central Florida
Language(s): English
Abstract/Description: In this work we investigate the reaction propagation velocity of aluminum and copper oxide Metastable Intermolecular Composites (MIC's). All samples were deposited in a magnetron sputtering system using 2 aluminum targets and 2 copper targets. The copper is sputtered in an oxygen rich environment in order to obtain copper oxide rich films. Three different layer structures are used for various measurements that are composed of alternating 20 layer pairs, 30 layer pairs, and 40 layer pairs. All layer pairs maintain a constant total thickness of 3.2 microns. Each layer structure can be prepared independent of a substrate and is measured with the use of photodiodes or with direct device contact. Aluminum and copper oxide structures have potential use as propellants and additives to explosives, thus, accurate propagation velocity or burn rate measurements are important. The developed measurement system for burn rate measurements of Al/CuO MIC's can achieve and accuracy of 0.1 m/s. In order to determine the velocity limiting characteristics, MIC's on glass and silicon substrates were measured as well as free standing Al/CuO MIC's. Separate burn rate measurement devices were created in order to handle the variety of substrates. In addition, the ignition energy of the Al/CuO MIC was studied to further characterize the samples. This was done using both voltage and current probes of a reacting sample. Rutherford backscattering spectroscopy (RBS) was used for sample composition calibration. The pre- and post-reaction Al/CuO MIC's were also characterized by transmission electron microscopy (TEM).
Identifier: CFE0002786 (IID), ucf:48093 (fedora)
Note(s): 2009-08-01
M.S.E.E.
Engineering and Computer Science, School of Electrical Engineering and Computer Science
Masters
This record was generated from author submitted information.
Subject(s): Thermites
Free Standing
Al/CuO
Persistent Link to This Record: http://purl.flvc.org/ucf/fd/CFE0002786
Restrictions on Access: campus 2010-07-01
Host Institution: UCF

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