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Design, Fabrication, and Interrogation of Integrated Wireless SAW Temperature Sensors

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Date Issued:
2015
Abstract/Description:
Wireless surface acoustic wave (SAW) sensors offer unique advantages over other sensor technologies because of their inherent ability to operate in harsh environments and completely passive operation, providing a reliable, maintenance-free life cycle. For certain SAW sensor applications the challenge is building a wirelessly interrogatable device with the same lifetime as the SAW substrate. The design of these application intensive sensors is complicated by the degradation of device bond wires, die adhesive, and antenna substrate. In an effort to maximize the benefits of the platform, this dissertation demonstrates wafer-level integrated SAW sensors that directly connect the thin film SAW to a thick film on-wafer antenna. Fully integrated device embodiments are presented that operate over a wide range of temperatures using different fabrication techniques, substrates, and coding principles.
Title: Design, Fabrication, and Interrogation of Integrated Wireless SAW Temperature Sensors.
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Name(s): Gallagher, Mark, Author
Malocha, Donald, Committee Chair
Richie, Samuel, Committee Member
Weeks, Arthur, Committee Member
Youngquist, Robert, Committee Member
Delfyett, Peter, Committee Member
University of Central Florida, Degree Grantor
Type of Resource: text
Date Issued: 2015
Publisher: University of Central Florida
Language(s): English
Abstract/Description: Wireless surface acoustic wave (SAW) sensors offer unique advantages over other sensor technologies because of their inherent ability to operate in harsh environments and completely passive operation, providing a reliable, maintenance-free life cycle. For certain SAW sensor applications the challenge is building a wirelessly interrogatable device with the same lifetime as the SAW substrate. The design of these application intensive sensors is complicated by the degradation of device bond wires, die adhesive, and antenna substrate. In an effort to maximize the benefits of the platform, this dissertation demonstrates wafer-level integrated SAW sensors that directly connect the thin film SAW to a thick film on-wafer antenna. Fully integrated device embodiments are presented that operate over a wide range of temperatures using different fabrication techniques, substrates, and coding principles.
Identifier: CFE0005795 (IID), ucf:50047 (fedora)
Note(s): 2015-08-01
Ph.D.
Engineering and Computer Science, Electrical Engineering and Computer Science
Doctoral
This record was generated from author submitted information.
Subject(s): Surface Acoustic Wave -- Wireless Sensors -- RFID
Persistent Link to This Record: http://purl.flvc.org/ucf/fd/CFE0005795
Restrictions on Access: public 2015-08-15
Host Institution: UCF

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