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Semiconductor Design and Manufacturing Interplay to Achieve Higher Yields at Reduced Costs using SMART Techniques

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Date Issued:
2018
Abstract/Description:
Since the outset of IC Semiconductor market there has been a gap between its design and manufacturing communities. This gap continued to grow as the device geometries started to shrink and the manufacturing processes and tools got more complex. This gap lowered the manufacturing yield, leading to higher cost of ICs and delay in their time to market. It also impacted performance of the ICs, impacting the overall functionality of the systems they were integrated in. However, in the recent years there have been major efforts to bridge the gap between design and manufacturing using software solutions by providing closer collaborations techniques between design and manufacturing communities. The root cause of this gap is inherited by the difference in the knowledge and skills required by the two communities. The IC design community is more microelectronics, electrical engineering and software driven whereas the IC manufacturing community is more driven by material science, mechanical engineering, physics and robotics. The cross training between the two is almost nonexistence and not even mandated. This gap is deemed to widen, with demand for more complex designs and miniaturization of electronic appliance-products. Growing need for MEMS, 3-D NANDS and IOTs are other drivers that could widen the gap between design and manufacturing. To bridge this gap, it is critical to have close loop solutions between design and manufacturing This could be achieved by SMART automation on both sides by using Artificial Intelligence, Machine Learning and Big Data algorithms. Lack of automation and predictive capabilities have even made the situation worse on the yield and total turnaround times. With the growing fabless and foundry business model, bridging the gap has become even more critical. Smart Manufacturing philosophy must be adapted to make this bridge possible. We need to understand the Fab-fabless collaboration requirements and the mechanism to bring design to the manufacturing floor for yield improvement. Additionally, design community must be educated with manufacturing process and tool knowledge, so they can design for improved manufacturability. This study will require understanding of elements impacting manufacturing on both ends of the design and manufacturing process. Additionally, we need to understand the process rules that need to be followed closely in the design phase. Best suited SMART automation techniques to bridge the gap need to be studied and analyzed for their effectiveness.
Title: Semiconductor Design and Manufacturing Interplay to Achieve Higher Yields at Reduced Costs using SMART Techniques.
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Name(s): Oberai, Ankush Bharati, Author
Yuan, Jiann-Shiun, Committee Chair
Abdolvand, Reza, Committee Member
Georgiopoulos, Michael, Committee Member
Sundaram, Kalpathy, Committee Member
Reilly, Charles, Committee Member
University of Central Florida, Degree Grantor
Type of Resource: text
Date Issued: 2018
Publisher: University of Central Florida
Language(s): English
Abstract/Description: Since the outset of IC Semiconductor market there has been a gap between its design and manufacturing communities. This gap continued to grow as the device geometries started to shrink and the manufacturing processes and tools got more complex. This gap lowered the manufacturing yield, leading to higher cost of ICs and delay in their time to market. It also impacted performance of the ICs, impacting the overall functionality of the systems they were integrated in. However, in the recent years there have been major efforts to bridge the gap between design and manufacturing using software solutions by providing closer collaborations techniques between design and manufacturing communities. The root cause of this gap is inherited by the difference in the knowledge and skills required by the two communities. The IC design community is more microelectronics, electrical engineering and software driven whereas the IC manufacturing community is more driven by material science, mechanical engineering, physics and robotics. The cross training between the two is almost nonexistence and not even mandated. This gap is deemed to widen, with demand for more complex designs and miniaturization of electronic appliance-products. Growing need for MEMS, 3-D NANDS and IOTs are other drivers that could widen the gap between design and manufacturing. To bridge this gap, it is critical to have close loop solutions between design and manufacturing This could be achieved by SMART automation on both sides by using Artificial Intelligence, Machine Learning and Big Data algorithms. Lack of automation and predictive capabilities have even made the situation worse on the yield and total turnaround times. With the growing fabless and foundry business model, bridging the gap has become even more critical. Smart Manufacturing philosophy must be adapted to make this bridge possible. We need to understand the Fab-fabless collaboration requirements and the mechanism to bring design to the manufacturing floor for yield improvement. Additionally, design community must be educated with manufacturing process and tool knowledge, so they can design for improved manufacturability. This study will require understanding of elements impacting manufacturing on both ends of the design and manufacturing process. Additionally, we need to understand the process rules that need to be followed closely in the design phase. Best suited SMART automation techniques to bridge the gap need to be studied and analyzed for their effectiveness.
Identifier: CFE0007351 (IID), ucf:52096 (fedora)
Note(s): 2018-12-01
Ph.D.
Engineering and Computer Science, Electrical Engineering and Computer Engineering
Doctoral
This record was generated from author submitted information.
Subject(s): DFM -- semiconductor yield -- yield management systems -- physical failure analysis -- machine learning -- deep learning -- artificial intelligence -- system in packages -- metrology -- virtual metrology -- design based inspection -- critical area analysis -- artificial intelligence -- critical dimensions -- computer aided design -- yield prediction -- artificial intelligence
Persistent Link to This Record: http://purl.flvc.org/ucf/fd/CFE0007351
Restrictions on Access: campus 2023-12-15
Host Institution: UCF

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