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Thermal Control of an Electronic Enclosure Utilizing a Vapor Chamber
| Title: | Thermal Control of an Electronic Enclosure Utilizing a Vapor Chamber. |
 38 views 13 downloads |
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| Name(s): |
Dougherty, Michael L., Author Evans, Ronald D., Committee Chair Engineering, Degree Grantor |
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| Type of Resource: | text | |
| Date Issued: | 1976 | |
| Publisher: | Florida Technological University | |
| Language(s): | English | |
| Abstract/Description: | Florida Technological University College of Engineering Thesis; This thesis addresses the problem of stracting heat from sealed electronic enclosures. Typical industry practice is to use various air-to-air and air-to-liquid heat exchangers. These techniques are known to require costly custom designs. This thesis points out how one can apply heat pipe technology in the form of a vapor chamber to solve this type of problem. The details on the design and testing of two prototype vapor chambers are cited. Included in the text are typical industrial applications that required sealed enclosures to protect their associated electronic control hardware. Also mentioned is some historical background on heat pipes. | |
| Identifier: | CFR0008162 (IID), ucf:53070 (fedora) | |
| Note(s): |
1976-01-01 M.S. Engineering Masters This record was generated from author submitted information. Electronically reproduced by the University of Central Florida from a book held in the John C. Hitt Library at the University of Central Florida, Orlando. |
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| Subject(s): | Thermionic emission | |
| Persistent Link to This Record: | http://purl.flvc.org/ucf/fd/CFR0008162 | |
| Restrictions on Access: | public | |
| Host Institution: | UCF |
