Current Search: failure (x)
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Title
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Design and Simulation of Device Failure Models for Electrostatic Discharge (ESD) Event.
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Creator
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Miao, Meng, Sundaram, Kalpathy, Yuan, Jiann-Shiun, Gong, Xun, Jin, Yier, Salcedo, Javier, University of Central Florida
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Abstract / Description
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In this dissertation, the research mainly focused on discussing ESD failure event simulation and ESD modeling, seeking solutions for ESD issues by simulating ESD event and predict possible ESD reliability problem in IC design. The research involves failure phenomenon caused by ESD/ EOS stress, mainly on the thermal failure due to inevitable self-heating during an ESD stress. Standard Complementary Metal-Oxide-Semiconductor (CMOS) process and high voltage Doublediffusion Metal-Oxide...
Show moreIn this dissertation, the research mainly focused on discussing ESD failure event simulation and ESD modeling, seeking solutions for ESD issues by simulating ESD event and predict possible ESD reliability problem in IC design. The research involves failure phenomenon caused by ESD/ EOS stress, mainly on the thermal failure due to inevitable self-heating during an ESD stress. Standard Complementary Metal-Oxide-Semiconductor (CMOS) process and high voltage Doublediffusion Metal-Oxide-Semiconductor (DMOS) process are used for design of experiment. A multi-function test platform High Power Pulse Instrument (HPPI) is used for ESD event evaluation and device characterization. SPICE-like software ADICE is for back-end simulation.Electrostatic Discharges (ESD) is one of the hazard that may affect IC circuit function and cause serious damage to the chip. The importance of ESD protection has been raised since the CMOS technology advanced and the dimension of transistors scales down. On the other hand, the variety of applications of chips is also making corresponding ESD protection difficult to meet different design requirement. Aside from typical requirements such as core circuit operation voltage, maximum accepted leakage current, breakdown conditions for the process and overall device sizes, special applications like radio frequency and power electronic requires ESD to be low parasitic capacitance and can sustain high level energy. In that case, a proper ESD protection design demands not only a robust ESD protection scheme, but co-design with the inner circuit. For that purpose, it is necessary to simulate the results of ESD impact on IC and find out possible weak point of the circuit and improve it. The first step of the simulation is to have corresponding models available. Unfortunately, ESD models, especially there are lack of circuit-level ESD models that provide quick and accurate prediction of ESD event.In this dissertation paper, ESD models, especially ESD failure models for device thermal failure are introduced, with modeling methodology accordingly. First, an introduction for ESD event and typical ESD protection schemes are introduced. Its purpose is to give basic concept of ESD. For ESD failure models, two typical types can be categorized depends on the physical mechanisms that cause the ESD damage. One is the gate oxide breakdown, which is electric field related. The other is the thermal-related failure, which stems from the self-heating effect associated with the large current passing through the ESD protection structure. The first one has become increasingly challenging with the aggressive scaling of the gate dielectric in advanced processes and ESD protection for that need to be carefully designed. The second one, thermal failure widely exists in semiconductor devices as long as there is ESD current flow through the device and accumulate heat at junctions. Considering the universality of thermal failure in ESD device, it is imperative to establish a model to simulate ESD caused thermal failure.Several works related to ESD model can be done. One crucial part for a failure model is to define the failure criterion. As common solution for ESD simulation and failure prediction. The maximum current level or breakdown voltage is used to judge whether a device fails under ESD stresses. Such failure criteria based on measurable voltage or current values are straightforward and can be easy to implemented in simulation tools. However, the shortcoming of these failure criteria is each failure criterion is specifically designed for certain ESD stress condition. For example, the failure voltage level for Human Body Model and Charged Device Model are quite different, and it is hard to judge a device's ESD capability under standard test conditions based on its transmission line pulse test result. So it is necessary to look deeper into the physical mechanism of device failure under ESD and find a more universal failure criterion for various stress conditions.As one of the major failure mechanisms, thermal failure evaluated by temperature is a more universal failure criterion for device failure under ESD stress. Whatever the stress model is, the device will fail if a critical temperature is reached at certain part inside the device and cause structural damage. Then finding out that critical temperature is crucial to define the failure point for device thermal failure. One chapter of this dissertation will focus on discussing this issue and propose a simple method to give close estimation of the real failure temperature for typical ESD devices.Combined these related works, a comprehensive diode model for ESD simulation is proposed. Using existing ESD models, diode I-V characteristic from low current turn-on to high current saturation can be simulated. By using temperature as the failure criterion, the last point of diode operation, or the second breakdown point, can be accurately predicted. Additional investigation of ESD capability of devices for special case like vertical GaN diode is discussed in Chapter IV. Due to the distinct material property of GaN, the vertical GaN diode exhibits unique and interesting quasi-static I-V curves quite different from conventional silicon semiconductor devices. And that I-V curve varies with different pulse width, indicating strong conductivity modulation of diode neutral region that will delay the complete turn-on of the vertical GaN diode.
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Date Issued
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2017
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Identifier
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CFE0006626, ucf:51291
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0006626
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Title
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Tensile-Compressive Asymmetry and Anisotropy of Fused Deposition Modeling PLA under Monotonic Conditions.
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Creator
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Perkowski, Casey, Gordon, Ali, Kassab, Alain, Divo, Eduardo, University of Central Florida
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Abstract / Description
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Additive Manufacturing (AM) continues to gain popularity for its ability to produce complexly-shaped final use components that are impractical to manufacture by traditional methods; however, additive manufactured parts contain complex mesostructures that result in directionally-dependent mechanical properties that have yet to be fully characterized. This effort demonstrates a framework of experimental and analytical methods needed to characterize the uniaxial monotonic behavior of fused...
Show moreAdditive Manufacturing (AM) continues to gain popularity for its ability to produce complexly-shaped final use components that are impractical to manufacture by traditional methods; however, additive manufactured parts contain complex mesostructures that result in directionally-dependent mechanical properties that have yet to be fully characterized. This effort demonstrates a framework of experimental and analytical methods needed to characterize the uniaxial monotonic behavior of fused deposition modeling PLA using tensile and compressive experiments on specimens printed at various orientations. Based on experimental results, the asymmetry and anisotropy of the tensile and compressive response was analyzed for a candidate material. Specimens from different orientations underwent microscopy and failure surface analysis to correlate test data. The material was observed to exhibit tetragonal behavior with tensile-compressive asymmetry. The experimental and simulated results show a strong correlation. Based on the collection of results, analysis, and computations, this work demonstrates a practice that can be used to characterize similar materials for use in AM components.
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Date Issued
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2017
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Identifier
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CFE0006778, ucf:51847
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0006778
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Title
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MODELING LOAN LOSSES: A MACROECONOMIC APPROACH.
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Creator
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Hughes, Jeremy, Smith, Stanley, University of Central Florida
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Abstract / Description
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A sound banking system is essential to a well-functioning economy. With the financial crisis beginning in 2007, a renewed interest in the safety of financial institutions has dominated both the political and financial landscape. Mounting loan losses in real estate lending led to the failing of over 460 banks from 2008 to 2012. This crisis is not unique; in fact, the Savings & Loan Crisis of the 1980's to early 1990's led to the closure of 700 savings institutions. Both instances created a...
Show moreA sound banking system is essential to a well-functioning economy. With the financial crisis beginning in 2007, a renewed interest in the safety of financial institutions has dominated both the political and financial landscape. Mounting loan losses in real estate lending led to the failing of over 460 banks from 2008 to 2012. This crisis is not unique; in fact, the Savings & Loan Crisis of the 1980's to early 1990's led to the closure of 700 savings institutions. Both instances created a panic in financial markets and heavy losses to deposit insurance funds. These losses are ultimately borne by taxpayers and prudently managed banks, especially if the insurance fund requires re-capitalization. The focus of this paper is on explaining the contributing factors to different categories of loan losses. Namely, total loan losses, residential real estate loan losses, commercial real estate loan losses, and commercial and industrial loan losses are examined. A multivariate regression approach is taken in this paper to explain the four rates of loan losses for the period of 2001 to 2012. Aggregate macroeconomic data from 2001 to 2012 is used to explain loan losses across categories. It was found that the delinquency rate of loans, the consumer financial obligations ratio, and the financial crisis were all significant factors in explaining loan losses.
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Date Issued
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2013
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Identifier
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CFH0004370, ucf:45001
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFH0004370
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Title
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STANDING WAVES OF SPATIALLY DISCRETE FITZHUGH-NAGUMO EQUATIONS.
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Creator
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Segal, Joseph, Moore, Brian, University of Central Florida
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Abstract / Description
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We study a system of spatially discrete FitzHugh-Nagumo equations, which are nonlinear differential-difference equations on an infinite one-dimensional lattice. These equations are used as a model of impulse propagation in nerve cells. We employ McKean's caricature of the cubic as our nonlinearity, which allows us to reduce the nonlinear problem into a linear inhomogeneous problem. We find exact solutions for standing waves, which are steady states of the system. We derive formulas for...
Show moreWe study a system of spatially discrete FitzHugh-Nagumo equations, which are nonlinear differential-difference equations on an infinite one-dimensional lattice. These equations are used as a model of impulse propagation in nerve cells. We employ McKean's caricature of the cubic as our nonlinearity, which allows us to reduce the nonlinear problem into a linear inhomogeneous problem. We find exact solutions for standing waves, which are steady states of the system. We derive formulas for all 1-pulse solutions. We determine the range of parameter values that allow for the existence of standing waves. We use numerical methods to demonstrate the stability of our solutions and to investigate the relationship between the existence of standing waves and propagation failure of traveling waves.
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Date Issued
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2009
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Identifier
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CFE0002892, ucf:48021
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0002892
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Title
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Multi-scale fluid-structure interaction model analysis of patient-specific geometry for optimization of lvad outflow graft implantation: an investigation aimed at reducing stroke risk.
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Creator
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Prather, Ray, Kassab, Alain, Mansy, Hansen, Bai, Yuanli, Divo, Eduardo, DeCampli, William, University of Central Florida
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Abstract / Description
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A Left Ventricular Assist Device (LVAD), is a mechanical pump capable of(&)nbsp;providing circulatory myocardium relief when used as bridge-to-transplantation by reducing the workload of a failing heart, with the additional bonus of allowing for cardiac recovery when used as destination therapy. The newer generations of continuous flow VADs are essentially axial or radial flow pumps, and while these devices are capable their efficiency depends upon fluid composition and flow field patterns....
Show moreA Left Ventricular Assist Device (LVAD), is a mechanical pump capable of(&)nbsp;providing circulatory myocardium relief when used as bridge-to-transplantation by reducing the workload of a failing heart, with the additional bonus of allowing for cardiac recovery when used as destination therapy. The newer generations of continuous flow VADs are essentially axial or radial flow pumps, and while these devices are capable their efficiency depends upon fluid composition and flow field patterns. The most devastating complication of VAD therapy is caused by embolization of thrombi formed within the LVAD or inside the heart into the brain leading to stroke. Anticoagulation management and improved LVADs design has reduced stroke incidence, however, investigators have recently reported the incidence of thromboembolic cerebral events is still significant and ranges from 14% to 47% over a period of 6-12 months. Blood clots may cause obstruction of critical vessels, such as cerebral arteries, reducing brain oxygenation and resulting in devastating consequences like major neurocognitive malfunction and complications which can be fatal.The hypothesis that incidence of stroke can be significantly reduced by adjusting the VAD outflow cannula implantation to direct dislodged thrombi away from the cerebral vessels has been recently supported by a series of steady flow computations assuming rigid vessel walls for the vasculature. Such studies have shown as much as a 50% reduction in embolization rates depending on outflow cannula implantation. In this study, a pulsatile fully compliant vessel wall model is developed to further establish this hypothesis. A time-dependent multi-scale Eulerian Computational Fluid Dynamics (CFD) analysis of patient-specific geometry models of the VAD-bed vasculature is coupled with a 3D Finite Element Analysis (FEA) of the mechanical response of the vascular walls to establish the VAD assisted hemodynamics. A Lagrangian particle tracking algorithm is used to determine the embolization rates of thrombi emanating from the cannula or other possible thrombogenic locations such as the aortic root. This multiscale Eulerian-Lagrangian pulsatile fluid-structure coupled paradigm allows for a fully realistic model of the hemodynamics of interest. The patient-specific geometries obtained from CT scan are implemented into the numerical domain in two modes. In the 3D CFD portion of the problem, the geometry accounts solely for the flow volume where the fluid is modelled as constant density and non-Newtonian under laminar pulsatile flow conditions. The blood-thrombus ensemble in treated as a two-phase flow, handled by an Eulerian-Lagrangian coupled scheme to solve the flow field and track particle transport. Thrombi are modelled as constant density spherical particles. Particle interactions are limited to particle-to-wall and particle-to-fluid, while particle-to-particle interaction are neglected for statistical purposes. On the other hand, with the help of Computer Aided Design (CAD) software a patient-specific aortic wall geometry with variable wall thickness is brought into the numerical domain. FEA is applied to determine the aortic wall cyclic displacement under hydrodynamic loads. To properly account for wall deformation, the arterial wall tissue incorporates a hyperelastic material model based on the anisotropic Holzapfel model for arteries. This paradigm is referred to as Fluid Structure Interaction (FSI) and allows structural analysis in conjunction with flow investigation to further monitor pathological flow patterns. The FSI model is driven by time dependent flow and pressure boundary conditions imposed at the boundaries of the 3D computational domain through a 50 degree of freedom 0D lumped parameter model (LPM) electric circuit analog of the peripheral VAD-assisted circulation.Results are presented for a simple vessel model of the ascending aorta to validate the anisotropic fiber orientation implementation. Arterial wall dilation is measured between 5-20% in the range reported in literature. Hemodynamics of the VAD assisted flow in a patient-derived geometry computed using rigid vessels walls are compared to those for a linearly elastic vessel wall model and a hyperelastic anisotropic vessel wall model. Moreover, the thromboembolization rates are presented and compared for pulsatile hemodynamics in rigid and compliant wall models. Pulsatile flow solutions for embolization probabilities corroborate the hypothesis that tailoring the LVAD cannula implantation configuration can significantly reduce thromboembolization rates, and this is consistent with indications from previous steady-flow calculations.
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Date Issued
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2018
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Identifier
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CFE0007077, ucf:52017
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0007077
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Title
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Factors Affecting Systems Engineering Rigor in Launch Vehicle Organizations.
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Creator
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Gibson, Denton, Karwowski, Waldemar, Rabelo, Luis, Kotnour, Timothy, Kern, David, University of Central Florida
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Abstract / Description
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Systems engineering is a methodical multi-disciplinary approach to design, build, and operate complex systems. Launch vehicles are considered by many extremely complex systems that have greatly impacted where the systems engineering industry is today. Launch vehicles are used to transport payloads from the ground to a location in space. Satellites launched by launch vehicles can range from commercial communications to national security payloads. Satellite costs can range from a few million...
Show moreSystems engineering is a methodical multi-disciplinary approach to design, build, and operate complex systems. Launch vehicles are considered by many extremely complex systems that have greatly impacted where the systems engineering industry is today. Launch vehicles are used to transport payloads from the ground to a location in space. Satellites launched by launch vehicles can range from commercial communications to national security payloads. Satellite costs can range from a few million dollars to billions of dollars. Prior research suggests that lack of systems engineering rigor as one of the leading contributors to launch vehicle failures. A launch vehicle failure could have economic, societal, scientific, and national security impacts. This is why it is critical to understand the factors that affect systems engineering rigor in U.S. launch vehicle organizations.The current research examined organizational factors that influence systems engineering rigor in launch vehicle organizations. This study examined the effects of the factors of systems engineering culture and systems engineering support on systems engineering rigor. Particularly, the effects of top management support, organizational commitment, systems engineering support, and value of systems engineering were examined. This research study also analyzed the mediating role of systems engineering support between top management support and systems engineering rigor, as well as between organizational commitment and systems engineering rigor. A quantitative approach was used for this. Data for the study was collected via survey instrument. A total of 203 people in various systems engineering roles in launch vehicle organizations throughout the United States voluntarily participated. Each latent construct of the study was validated using confirmatory factor analysis (CFA). Structural equation modeling (SEM) was used to examine the relationships between the variables of the study. The IBM SPSS Amos 25 software was used to analyze the CFA and SEM.
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Date Issued
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2019
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Identifier
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CFE0007806, ucf:52348
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0007806
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Title
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A study on the plasticity and fracture of AISI 4340 steel under different loading conditions considering heat treatment and micromechanics.
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Creator
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Ghazali, Sami, Bai, Yuanli, Kassab, Alain, Kwok, Kawai, Nam, Boo Hyun, University of Central Florida
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Abstract / Description
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Accurate predictions of material strength under different loading conditions with large plastic deformation and ductile fracture are of great importance. This dissertation aims to develop an essential understanding of ductile fracture of AISI 4340 steel alloy using both empirical and micromechanics based models. For this purpose, 29 specimens of different geometries with different heat-treatments were designed to investigate the effects of stress states. These specimens are: (a) 13 round bars...
Show moreAccurate predictions of material strength under different loading conditions with large plastic deformation and ductile fracture are of great importance. This dissertation aims to develop an essential understanding of ductile fracture of AISI 4340 steel alloy using both empirical and micromechanics based models. For this purpose, 29 specimens of different geometries with different heat-treatments were designed to investigate the effects of stress states. These specimens are: (a) 13 round bars with different notches (axial symmetric tension); (b) 13 flat grooved specimens with different grooves; (c) 3 small round cylinders. Mechanical tests up to fracture were conducted on these specimens to characterize the influence of hydrostatic stress and Lode angle on material plasticity and fracture. Scanning electron microscopy (SEM) observations were performed on both original and fractured specimens to investigate different micromechanical revelations and features. The plasticity model with pressure and Lode angle effects (PPL model) and the modified Mohr-Coulomb (MMC) fracture criterion were used to predict plastic flow and fracture initiation behaviors under different loading conditions in finite element simulations. A model optimization method using ISIGHT was set up to achieve simulation results that were well correlated with experimental data. The effects of heat-treatment on material strength and ductility of AISI 4340 steel were also discussed. This work was further carried onto the microvoids based metal plasticity theory. The well-known Gurson-Tvergaard-Needleman (GTN) model was calibrated for AISI 4340 steel. It is found that the GTN model is not sufficient in simulating test data for the 16 Rockwell hardness plane strain specimens. Therefore, The GTN model is modified to include the Lode angle dependence on matrix material plasticity. It is also found that using afixed or constant microvoid volume fraction at failure (ff) for all loading conditions is inadequate. Following a similar derivation of the MMC fracture model, the microvoid volume fraction at failure (ff) becomes a function of both stress triaxiality and Lode angle. This new criterion is named (GTN-MMC). The proposed plasticity and fracture models were implemented into ABAQUS through a user-defined material subroutine (VUMAT) for FE simulations. Good correlations were achieved between experimental results and numerical simulations
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Date Issued
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2018
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Identifier
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CFE0007004, ucf:52026
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0007004
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Title
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Implementation And Performance Comparisons For The Crisfield And Stiff Arc Length Methods In FEA.
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Creator
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Silvers, Thomas, Gordon, Ali, Nicholson, David, Kassab, Alain, Ilie, Marcel, University of Central Florida
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Abstract / Description
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In Nonlinear Finite Element Analysis (FEA) applied to structures, displacements at which the tangent stiffness matrix KT becomes singular are called critical points, and correspond to instabilities such as buckling or elastoplastic softening (e.g., necking). Prior to the introduction of Arc Length Methods (ALMs), critical points posed severe computational challenges, which was unfortunate since behavior at instabilities is of great interest as a precursor to structural failure. The original...
Show moreIn Nonlinear Finite Element Analysis (FEA) applied to structures, displacements at which the tangent stiffness matrix KT becomes singular are called critical points, and correspond to instabilities such as buckling or elastoplastic softening (e.g., necking). Prior to the introduction of Arc Length Methods (ALMs), critical points posed severe computational challenges, which was unfortunate since behavior at instabilities is of great interest as a precursor to structural failure. The original ALM was shown to be capable in some circumstances of continued computation at critical points, but limited success and unattractive features of the formulation were noted and addressed in extensive subsequent research. The widely used Crisfield Cylindrical and Spherical ALMs may be viewed as representing the 'state-of-the-art'. The more recent Stiff Arc Length method, which is attractive on fundamental grounds, was introduced in 2004, but without implementation, benchmarking or performance assessment. The present thesis addresses (a) implementation and (b) performance comparisons for the Crisfield and Stiff methods, using simple benchmarks formulated to incorporate elastoplastic softening. It is seen that, in contrast to the Crisfield methods, the Stiff ALM consistently continues accurate computation at, near and beyond critical points.
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Date Issued
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2012
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Identifier
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CFE0004277, ucf:49544
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0004277
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Title
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Semiconductor Design and Manufacturing Interplay to Achieve Higher Yields at Reduced Costs using SMART Techniques.
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Creator
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Oberai, Ankush Bharati, Yuan, Jiann-Shiun, Abdolvand, Reza, Georgiopoulos, Michael, Sundaram, Kalpathy, Reilly, Charles, University of Central Florida
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Abstract / Description
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Since the outset of IC Semiconductor market there has been a gap between its design and manufacturing communities. This gap continued to grow as the device geometries started to shrink and the manufacturing processes and tools got more complex. This gap lowered the manufacturing yield, leading to higher cost of ICs and delay in their time to market. It also impacted performance of the ICs, impacting the overall functionality of the systems they were integrated in. However, in the recent years...
Show moreSince the outset of IC Semiconductor market there has been a gap between its design and manufacturing communities. This gap continued to grow as the device geometries started to shrink and the manufacturing processes and tools got more complex. This gap lowered the manufacturing yield, leading to higher cost of ICs and delay in their time to market. It also impacted performance of the ICs, impacting the overall functionality of the systems they were integrated in. However, in the recent years there have been major efforts to bridge the gap between design and manufacturing using software solutions by providing closer collaborations techniques between design and manufacturing communities. The root cause of this gap is inherited by the difference in the knowledge and skills required by the two communities. The IC design community is more microelectronics, electrical engineering and software driven whereas the IC manufacturing community is more driven by material science, mechanical engineering, physics and robotics. The cross training between the two is almost nonexistence and not even mandated. This gap is deemed to widen, with demand for more complex designs and miniaturization of electronic appliance-products. Growing need for MEMS, 3-D NANDS and IOTs are other drivers that could widen the gap between design and manufacturing. To bridge this gap, it is critical to have close loop solutions between design and manufacturing This could be achieved by SMART automation on both sides by using Artificial Intelligence, Machine Learning and Big Data algorithms. Lack of automation and predictive capabilities have even made the situation worse on the yield and total turnaround times. With the growing fabless and foundry business model, bridging the gap has become even more critical. Smart Manufacturing philosophy must be adapted to make this bridge possible. We need to understand the Fab-fabless collaboration requirements and the mechanism to bring design to the manufacturing floor for yield improvement. Additionally, design community must be educated with manufacturing process and tool knowledge, so they can design for improved manufacturability. This study will require understanding of elements impacting manufacturing on both ends of the design and manufacturing process. Additionally, we need to understand the process rules that need to be followed closely in the design phase. Best suited SMART automation techniques to bridge the gap need to be studied and analyzed for their effectiveness.
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Date Issued
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2018
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Identifier
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CFE0007351, ucf:52096
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0007351
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Title
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Characterization of Anisotropic Mechanical Performance of As-Built Additively Manufactured Metals.
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Creator
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Siddiqui, Sanna, Gordon, Ali, Raghavan, Seetha, Bai, Yuanli, Sohn, Yongho, University of Central Florida
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Abstract / Description
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Additive manufacturing (AM) technologies use a 3D Computer Aided Design (CAD) model to develop a component through a deposition and fusion layer process, allowing for rapid design and geometric flexibility of metal components, for use in the aerospace, energy and biomedical industries. Challenges exist with additive manufacturing that limits its replacement of conventional manufacturing techniques, most especially a comprehensive understanding of the anisotropic behavior of these materials...
Show moreAdditive manufacturing (AM) technologies use a 3D Computer Aided Design (CAD) model to develop a component through a deposition and fusion layer process, allowing for rapid design and geometric flexibility of metal components, for use in the aerospace, energy and biomedical industries. Challenges exist with additive manufacturing that limits its replacement of conventional manufacturing techniques, most especially a comprehensive understanding of the anisotropic behavior of these materials and how it is reflected in observed tensile, torsional and fatigue mechanical responses. As such, there is a need to understand how the build orientation of as-built additively manufactured metals, affects mechanical performance (e.g. monotonic and cyclic behavior, cyclically hardening/softening behavior, plasticity effects on fatigue life etc.); and to use constitutive modeling to both support experimental findings, and provide approximations of expected behavior (e.g. failure surfaces, monotonic and cyclic response, correlations between tensile and fatigue properties), for orientations and experiments not tested, due to the expensive cost associated with AM. A comprehensive framework has been developed to characterize the anisotropic behavior of as-built additively manufactured metals (i.e. Stainless Steel GP1 (SS GP1), similar in chemical composition to Stainless Steel 17-4PH), through a series of mechanical testing, microscopic evaluation and constitutive modeling, which were used to identify a reduced specimen size for characterizing these materials. An analysis of the torsional response of additively manufactured Inconel 718 has been performed to assess the impact of build orientation and as-built conditions on the shearing behavior of this material. Experimental results from DMLS SS GP1 and AM Inconel 718 from literature were used to constitutively model the material responses of these additively manufactured metals. Overall, this framework has been designed to serve as standard, from which build orientation selection can be used to meet specific desired industry requirements.
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Date Issued
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2018
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Identifier
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CFE0007097, ucf:52883
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0007097
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Title
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Continuous Oscillation: Vibrational Effects and Acceptable Frequency Ranges of Small Bore Piping in Field Applications.
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Creator
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Kasprzyk, Marie, Kauffman, Jeffrey L., Bai, Yuanli, Gordon, Ali, University of Central Florida
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Abstract / Description
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In turbomachinery, a common failure mode is cracking of welds at the equipment and piping connection point. Each incidence of these cracks causes a forced shutdown to perform repairs that cost millions of dollars. This type of failure is predominately seen in small bore piping, which has a nominal diameter of 2 inches and smaller. This thesis addresses the failure prediction analysis of small bore piping, specifically in turbomachinery applications. Performing failure analysis to predict the...
Show moreIn turbomachinery, a common failure mode is cracking of welds at the equipment and piping connection point. Each incidence of these cracks causes a forced shutdown to perform repairs that cost millions of dollars. This type of failure is predominately seen in small bore piping, which has a nominal diameter of 2 inches and smaller. This thesis addresses the failure prediction analysis of small bore piping, specifically in turbomachinery applications. Performing failure analysis to predict the potential cracking of welds will allow for replacement of the piping during a planned shutdown which in the long term saves money due to costs such as expediting materials, overtime pay, and extended downtime. This analysis uses real-world applications of a chemical plant in Louisiana. The piping analyzed was connected to centrifugal compressors. The data used from these pieces of equipment included the material of construction, the piping schedule, lengths, nominal diameter, and running speeds. Based on research that shows welding the connection point with a full penetration weld greatly increases the life expectancy of the connection, this thesis uses full penetration welds in the analysis. The piping was analyzed using the software ANSYS to perform a finite element analysis, specifically examining the stress due to the induced harmonic forces. It is a common fact that having fewer supports on a vibrating pipe induces greater stresses and strains on the weld connections. Supports installed 12" from the equipment only show one to two ranges of frequencies to avoid compared to the longer piping which has four to five ranges of unacceptable frequencies. Tables are developed to relay acceptable frequencies based on observed stresses of the welds in the model.
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Date Issued
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2017
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Identifier
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CFE0006749, ucf:51862
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0006749
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Title
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Adaptive Architectural Strategies for Resilient Energy-Aware Computing.
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Creator
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Ashraf, Rizwan, DeMara, Ronald, Lin, Mingjie, Wang, Jun, Jha, Sumit, Johnson, Mark, University of Central Florida
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Abstract / Description
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Reconfigurable logic or Field-Programmable Gate Array (FPGA) devices have the ability to dynamically adapt the computational circuit based on user-specified or operating-condition requirements. Such hardware platforms are utilized in this dissertation to develop adaptive techniques for achieving reliable and sustainable operation while autonomously meeting these requirements. In particular, the properties of resource uniformity and in-field reconfiguration via on-chip processors are exploited...
Show moreReconfigurable logic or Field-Programmable Gate Array (FPGA) devices have the ability to dynamically adapt the computational circuit based on user-specified or operating-condition requirements. Such hardware platforms are utilized in this dissertation to develop adaptive techniques for achieving reliable and sustainable operation while autonomously meeting these requirements. In particular, the properties of resource uniformity and in-field reconfiguration via on-chip processors are exploited to implement Evolvable Hardware (EHW). EHW utilize genetic algorithms to realize logic circuits at runtime, as directed by the objective function. However, the size of problems solved using EHW as compared with traditional approaches has been limited to relatively compact circuits. This is due to the increase in complexity of the genetic algorithm with increase in circuit size. To address this research challenge of scalability, the Netlist-Driven Evolutionary Refurbishment (NDER) technique was designed and implemented herein to enable on-the-fly permanent fault mitigation in FPGA circuits. NDER has been shown to achieve refurbishment of relatively large sized benchmark circuits as compared to related works. Additionally, Design Diversity (DD) techniques which are used to aid such evolutionary refurbishment techniques are also proposed and the efficacy of various DD techniques is quantified and evaluated.Similarly, there exists a growing need for adaptable logic datapaths in custom-designed nanometer-scale ICs, for ensuring operational reliability in the presence of Process, Voltage, and Temperature (PVT) and, transistor-aging variations owing to decreased feature sizes for electronic devices. Without such adaptability, excessive design guardbands are required to maintain the desired integration and performance levels. To address these challenges, the circuit-level technique of Self-Recovery Enabled Logic (SREL) was designed herein. At design-time, vulnerable portions of the circuit identified using conventional Electronic Design Automation tools are replicated to provide post-fabrication adaptability via intelligent techniques. In-situ timing sensors are utilized in a feedback loop to activate suitable datapaths based on current conditions that optimize performance and energy consumption. Primarily, SREL is able to mitigate the timing degradations caused due to transistor aging effects in sub-micron devices by reducing the stress induced on active elements by utilizing power-gating. As a result, fewer guardbands need to be included to achieve comparable performance levels which leads to considerable energy savings over the operational lifetime.The need for energy-efficient operation in current computing systems has given rise to Near-Threshold Computing as opposed to the conventional approach of operating devices at nominal voltage. In particular, the goal of exascale computing initiative in High Performance Computing (HPC) is to achieve 1 EFLOPS under the power budget of 20MW. However, it comes at the cost of increased reliability concerns, such as the increase in performance variations and soft errors. This has given rise to increased resiliency requirements for HPC applications in terms of ensuring functionality within given error thresholds while operating at lower voltages. My dissertation research devised techniques and tools to quantify the effects of radiation-induced transient faults in distributed applications on large-scale systems. A combination of compiler-level code transformation and instrumentation are employed for runtime monitoring to assess the speed and depth of application state corruption as a result of fault injection. Finally, fault propagation models are derived for each HPC application that can be used to estimate the number of corrupted memory locations at runtime. Additionally, the tradeoffs between performance and vulnerability and the causal relations between compiler optimization and application vulnerability are investigated.
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Date Issued
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2015
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Identifier
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CFE0006206, ucf:52889
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0006206
Pages