Current Search: Photoresist (x)
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Title
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A NEW HYBRID DIFFRACTIVE PHOTO-MASK TECHNOLOGY.
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Creator
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Sung, Jin Won, Johnson, Eric, University of Central Florida
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Abstract / Description
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In the field of photolithography for micro-chip manufacturing, the photo-mask is used to print desired patterns on a proper photo-resist on wafer. The most common type of photo-mask is binary amplitude mask made an opaque layer of chrome. The principle and potential application of hybrid photo-mask with diffractive phase element and binary amplitude is presented in this dissertation paper from both numerical modeling and experimental research. The first important application is the...
Show moreIn the field of photolithography for micro-chip manufacturing, the photo-mask is used to print desired patterns on a proper photo-resist on wafer. The most common type of photo-mask is binary amplitude mask made an opaque layer of chrome. The principle and potential application of hybrid photo-mask with diffractive phase element and binary amplitude is presented in this dissertation paper from both numerical modeling and experimental research. The first important application is the characterization of aberration in the stepper system using hybrid diffractive photo-mask. By utilizing multiple diffractive illumination conditions, it is possible to characterize Zernike wave front aberration coefficients up to any desired order. And, the second application is the use of binary phase grating mask for analog micro-optics fabrication. This approach of using binary phase grating mask for fabricating analog micro-optics turned out to be a very effective alternative for gray-scale mask technology. Since this is a pure phase only mask, it doesn't cause any scattered noise light like half-tone mask and it results in smooth desired resist profile. The benefits and limitations of hybrid diffractive photo-mask approach for both applications are discussed.
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Date Issued
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2005
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Identifier
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CFE0000350, ucf:46296
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0000350
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Title
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PROCESS DEVELOPMENT FOR THE FABRICATION OF MESOSCALE ELECTROSTATIC VALVE ASSEMBLY.
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Creator
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Dhru, Shailini, Sundaram, Kalpathy, University of Central Florida
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Abstract / Description
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This study concentrates on two of the main processes involved in the fabrication of electrostatic valve assembly, thick resist photolithography and wet chemical etching of a polyamide film. The electrostatic valve has different orifice diameters of 25, 50, 75 and 100 μm. These orifice holes are to be etched in the silicon wafer with deep reactive ion etching. The photolithography process is developed to build a mask of 15 μm thick resist pattern on silicon wafer. This photo layer...
Show moreThis study concentrates on two of the main processes involved in the fabrication of electrostatic valve assembly, thick resist photolithography and wet chemical etching of a polyamide film. The electrostatic valve has different orifice diameters of 25, 50, 75 and 100 μm. These orifice holes are to be etched in the silicon wafer with deep reactive ion etching. The photolithography process is developed to build a mask of 15 μm thick resist pattern on silicon wafer. This photo layer acts as a mask for deep reactive ion etching. Wet chemical etching process is developed to etch kapton polyamide film. This etched film is used as a stand off, gap between two electrodes of the electrostatic valve assembly. The criterion is to develop the processed using standard industry tools. Pre post etch effects, such as, surface roughness, etching pattern, critical dimensions on the samples are measured with Veeco profilometer.
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Date Issued
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2007
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Identifier
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CFE0001828, ucf:47347
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Format
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Document (PDF)
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PURL
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http://purl.flvc.org/ucf/fd/CFE0001828
