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ASSESSING THE VIABILITY OF SOL-GEL NIMGO FILMS FOR SOLAR BLIND DETECTION
Title
ASSESSING THE VIABILITY OF SOL-GEL NIMGO FILMS FOR SOLAR BLIND DETECTION.
Creator
Scheurer, Amber, Schoenfeld, Winston, University of Central Florida
Abstract / Description
Wide bandgap semiconductors have been broadly investigated for their potential to detect and emit high energy ultraviolet (UV) photons. Advancements in deep UV optoelectronic materials would enable the efficient and affordable realization of many medical, industrial and consumer UV optical devices. The traditional growth method, vacuum deposition, is an extremely complicated and expensive process. Sol-gel processing dramatically simplifies facility requirements and can be scaled to industrial...
Show moreWide bandgap semiconductors have been broadly investigated for their potential to detect and emit high energy ultraviolet (UV) photons. Advancements in deep UV optoelectronic materials would enable the efficient and affordable realization of many medical, industrial and consumer UV optical devices. The traditional growth method, vacuum deposition, is an extremely complicated and expensive process. Sol-gel processing dramatically simplifies facility requirements and can be scaled to industrial size. The work presented here involves a novel study of the ternary wide bandgap material Ni1-xMgxO. Films were developed by sol-gel spin coating for investigation of material and electrical properties. This method produced films 200-600 nm thick with surface roughness below 4 nm RMS. Sintered films indicated an improvement from 60% to 90% transmission near the band edge. Additionally, compositional analysis was performed by X-ray Photoelectron Spectroscopy and film defects were characterized by photoluminescence using a continuous wave He-Cd UV laser, revealing the expected oxygen defect at 413nm. This film growth technique has produced thin polycrystalline films with low surface roughness and a high degree of crystalline orientation; crucial characteristics for semiconductor devices. These films have demonstrated the ability to be tuned over the full compositional range from the bandgap of NiO (3.6 eV) to that of MgO (7.8 eV). Optoelectronic devices produced by standard photolithographic techniques are discussed as well as the electrical transport properties of their metal contacts. Based on initial results, these films have demonstrated strong potential as solar blind detectors of UV radiation.
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Date Issued
2011
Identifier
CFH0003800, ucf:44768
Format
Document (PDF)
PURL
http://purl.flvc.org/ucf/fd/CFH0003800
EPITAXIAL GROWTH, CHARACTERIZATION AND APPLICATION OF NOVEL WIDE BANDGAP OXIDE SEMICONDUCTORS
Title
EPITAXIAL GROWTH, CHARACTERIZATION AND APPLICATION OF NOVEL WIDE BANDGAP OXIDE SEMICONDUCTORS.
Creator
Mares, Jeremy, Schoenfeld, Winston, University of Central Florida
Abstract / Description
In this work, a body of knowledge is presented which pertains to the growth, characterization and exploitation of high quality, novel II-IV oxide epitaxial films and structures grown by plasma-assisted molecular beam epitaxy. The two compounds of primary interest within this research are the ternary films NixMg1-xO and ZnxMg1-xO and the investigation focuses predominantly on the realization, assessment and implementation of these two oxides as optoelectronic materials. The functioning...
Show moreIn this work, a body of knowledge is presented which pertains to the growth, characterization and exploitation of high quality, novel II-IV oxide epitaxial films and structures grown by plasma-assisted molecular beam epitaxy. The two compounds of primary interest within this research are the ternary films NixMg1-xO and ZnxMg1-xO and the investigation focuses predominantly on the realization, assessment and implementation of these two oxides as optoelectronic materials. The functioning hypothesis for this largely experimental effort has been that these cubic ternary oxides can be exploited - and possibly even juxtaposed - to realize novel wide band gap optoelectronic technologies. The results of the research conducted presented herein overwhelmingly support this hypothesis in that they confirm the possibility to grow these films with sufficient quality by this technique, as conjectured. NixMg1-xO films with varying Nickel concentrations ranging from x = 0 to x = 1 have been grown on lattice matched MgO substrates (lattice mismatch ε < 0.01) and characterized structurally, morphologically, optically and electrically. Similarly, cubic ZnxMg1-xO films with Zinc concentrations ranging from x = 0 to x ≈ 0.53, as limited by phase segregation, have also been grown and characterized. Photoconductive devices have been designed and fabricated from these films and characterized. Successfully engineered films in both categories exhibit the desired deep ultraviolet photoresponse and therefore verify the hypothesis. While the culminating work of interest here focuses on the two compounds discussed above, the investigation has also involved the characterization or exploitation of related films including hexagonal phase ZnxMg1-xO, ZnO, CdxZn1-xO and hybrid structures based on these compounds used in conjunction with GaN. These works were critical precursors to the growth of cubic oxides, however, and are closely relevant. Viewed in its entirety, this document can therefore be considered a multifaceted interrogation of several novel oxide compounds and structures, both cubic and wurtzite in structure. The conclusions of the research can be stated succinctly as a quantifiably successful effort to validate the use of these compounds and structures for wide bandgap optoelectronic technologies.
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Date Issued
2010
Identifier
CFE0003125, ucf:48625
Format
Document (PDF)
PURL
http://purl.flvc.org/ucf/fd/CFE0003125
Design and Characterization of High Temperature Packaging for Wide-Bandgap Semiconductor Devices
Title
Design and Characterization of High Temperature Packaging for Wide-Bandgap Semiconductor Devices.
Creator
Grummel, Brian, Shen, Zheng, Sundaram, Kalpathy, Yuan, Jiann-Shiun, University of Central Florida
Abstract / Description
Advances in wide-bandgap semiconductor devices have increased the allowable operating temperature of power electronic systems. High-temperature devices can benefit applications such as renewable energy, electric vehicles, and space-based power electronics that currently require bulky cooling systems for silicon power devices. Cooling systems can typically be reduced in size or removed by adopting wide-bandgap semiconductor devices, such as silicon carbide. However, to do this, semiconductor...
Show moreAdvances in wide-bandgap semiconductor devices have increased the allowable operating temperature of power electronic systems. High-temperature devices can benefit applications such as renewable energy, electric vehicles, and space-based power electronics that currently require bulky cooling systems for silicon power devices. Cooling systems can typically be reduced in size or removed by adopting wide-bandgap semiconductor devices, such as silicon carbide. However, to do this, semiconductor device packaging with high reliability at high temperatures is necessary. Transient liquid phase (TLP) die-attach has shown in literature to be a promising bonding technique for this packaging need. In this work TLP has been comprehensively investigated and characterized to assess its viability for high-temperature power electronics applications. The reliability and durability of TLP die-attach was extensively investigated utilizing electrical resistivity measurement as an indicator of material diffusion in gold-indium TLP samples. Criteria of ensuring diffusive stability were also developed. Samples were fabricated by material deposition on glass substrates with variant Au(-)In compositions but identical barrier layers. They were stressed with thermal cycling to simulate their operating conditions then characterized and compared. Excess indium content in the die-attach was shown to have poor reliability due to material diffusion through barrier layers while samples containing suitable indium content proved reliable throughout the thermal cycling process. This was confirmed by electrical resistivity measurement, EDS, FIB, and SEM characterization. Thermal and mechanical characterization of TLP die-attached samples was also performed to gain a newfound understanding of the relationship between TLP design parameters and die-attach properties. Samples with a SiC diode chip TLP bonded to a copper metalized silicon nitride substrate were made using several different values of fabrication parameters such as gold and indium thickness, Au(-)In ratio, and bonding pressure. The TLP bonds were then characterized for die-attach voiding, shear strength, and thermal impedance. It was found that TLP die-attach offers high average shear force strength of 22.0 kgf and a low average thermal impedance of 0.35 K/W from the device junction to the substrate. The influence of various fabrication parameters on the bond characteristics were also compared, providing information necessary for implementing TLP die-attach into power electronic modules for high-temperature applications. The outcome of the investigation on TLP bonding techniques was incorporated into a new power module design utilizing TLP bonding. A full half-bridge inverter power module for low-power space applications has been designed and analyzed with extensive finite element thermo-mechanical modeling. In summary, TLP die-attach has investigated to confirm its reliability and to understand how to design effective TLP bonds, this information has been used to design a new high-temperature power electronic module.
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Date Issued
2012
Identifier
CFE0004499, ucf:49276
Format
Document (PDF)
PURL
http://purl.flvc.org/ucf/fd/CFE0004499